Journal of Electronic Packaging

Journal

Overview
Identity

Publication Venue For

Finite element predictions of the effect of diffusion-accommodated interfacial sliding on thermal stresses in Cu/polymer dielectric and Cu/oxide dielectric single level damascene interconnect structures. 124:12-21. 2002

Has Subject Area

Mechanical Engineering & Transports

International Standard Serial Number (issn)

1043-7398

Electronic International Standard Serial Number (eissn)

1528-9044