Finite element predictions of the effect of diffusion-accommodated interfacial sliding on thermal stresses in Cu/polymer dielectric and Cu/oxide dielectric single level damascene interconnect structures

Academic Article

Authors

Status

Publication Date

  • March 2002
  • Keywords

  • copper
  • damascene interconnect structure
  • finite element analysis
  • interfacial sliding
  • thermal stresses
  • Digital Object Identifier (doi)

    Start Page

  • 12
  • End Page

  • 21
  • Volume

  • 124
  • Issue

  • 1