Microstructure design to achieve optimal strength, thermal stability, and electrical conductivity of Al-7.5wt.%Y alloy

Academic Article

Authors

  • Wang, Mengmeng
  • Knezevic, Marko
  • Chen, Ming
  • Li, Jiansheng
  • Liu, Tong
  • Wang, Gang
  • Zhao, Yu
  • Wang, Miao
  • Liu, Qi
  • Huang, Zhongjia
  • Du, Dafan
  • Gao, Haiyan
  • Wang, Jun
  • Sun, Baode

    • Status

    Publication Date

  • September 5, 2022

    • Has Subject Area

    Published In

    Keywords

  • Electrical conductivity
  • Heat resistance
  • Stacking fault
  • Strength
  • Texture

    • Digital Object Identifier (doi)

    Start Page

  • 143700

    • End Page

  • 143700

    • Volume

  • 852