Thermomechanical deformation of 1 mu m thick Cu-polyimide line arrays studied by scanning probe microscopy

Academic Article

Authors

  • Zhmurkin, DV
  • Gross, Todd
  • Buchwalter, LP
  • Kaufman, FB

    • Status

    Publication Date

  • June 1996

    • Has Subject Area

    Published In

    Keywords

  • atomic force microscope
  • coefficient of thermal expansion
  • interconnects
  • polyimide
  • thermal expansion

    • Digital Object Identifier (doi)

    Start Page

  • 976

    • End Page

  • 982

    • Volume

  • 25

    • Issue

  • 6