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Thermomechanical deformation of 1 mu m thick Cu-polyimide line arrays studied by scanning probe microscopy
Academic Article
View record in Web of Science ®
Overview
Grants
Identity
Additional Document Info
Overview
Authors
Zhmurkin, DV
Gross, Todd
Buchwalter, LP
Kaufman, FB
Status
published
Publication Date
June 1996
Has Subject Area
Applied Physics
Published In
Journal of Electronic Materials
Journal
Grants
Keywords
atomic force microscope
coefficient of thermal expansion
interconnects
polyimide
thermal expansion
Identity
Digital Object Identifier (doi)
10.1007/BF02666733
Additional Document Info
Start Page
976
End Page
982
Volume
25
Issue
6