Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling

Academic Article

Authors

  • Zhmurkin, DV
  • Gross, Todd
  • Buchwalter, LP
  • Status

    Publication Date

  • July 1997
  • Has Subject Area

    Published In

    Keywords

  • atomic force microscope
  • interconnects
  • polyimide
  • stress relaxation
  • thermal deformation
  • Digital Object Identifier (doi)

    Start Page

  • 791
  • End Page

  • 797
  • Volume

  • 26
  • Issue

  • 7