Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region

Conference Proceeding

Authors

Status

Publication Date

  • 2006
  • Presented At Event

    Keywords

  • copper interconnects
  • diffusional creep
  • finite elements
  • grain boundary
  • nanoscale deformation
  • Digital Object Identifier (doi)

    International Standard Book Number (isbn) 10

  • 1-84564-162-0
  • Start Page

  • 685
  • End Page

  • +
  • Volume

  • 85