Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region

Conference Paper

Authors

Status

Publication Date

  • 2006

    • Published In

    Presented At Event

    Keywords

  • copper interconnects
  • diffusional creep
  • finite elements
  • grain boundary
  • nanoscale deformation

    • Digital Object Identifier (doi)

    International Standard Book Number (isbn) 10

  • 1-84564-162-0

    • Start Page

  • 685

    • End Page

  • +

    • Volume

  • 85