Numerical modeling of grain boundary effectis in the diffusional creep of copper interconnect lines

Academic Article

Authors

  • Grychanyuk, V
  • Tsukrov, Igor
  • Gross, Todd
  • Status

    Publication Date

  • May 2004
  • Published In

    Keywords

  • copper interconnects
  • diffusional creep
  • grain boundary
  • Digital Object Identifier (doi)

    Start Page

  • L149
  • End Page

  • L154
  • Volume

  • 127
  • Issue

  • 2