Numerical modeling of grain boundary effectis in the diffusional creep of copper interconnect lines

Academic Article

Authors

  • Grychanyuk, V
  • Tsukrov, Igor
  • Gross, T

    • Status

    Publication Date

  • May 2004

    • Has Subject Area

    Published In

    Keywords

  • copper interconnects
  • diffusional creep
  • grain boundary

    • Digital Object Identifier (doi)

    Start Page

  • L149

    • End Page

  • L154

    • Volume

  • 127

    • Issue

  • 2