Positions

Publications

Academic Article

Year Title
2018 A Thermodynamic Study of Adsorption of Benzyl Viologen and Polyethylene Glycol and Their Displacement by 3-Mercapto-1-Propanesulfonate during Copper ElectrodepositionJournal of the Electrochemical Society.  165:D231-D235. 2018
2017 Nonlinear evolution of a thin anodic filmProceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences.  473:20160930-20160930. 2017
2017 Parametric Study, Sensitivity Analysis, and Optimization of Polyol Synthesis of Silver NanowiresECS Journal of Solid State Science and Technology.  6:P132-P137. 2017
2017 Silver Nanowire Synthesis in a Continuous Millifluidic ReactorECS Journal of Solid State Science and Technology.  6:P144-P149. 2017
2016 Rheological behavior of silver nanowire conductive inks during screen printingJournal of Nanoparticle Research.  18:1-11. 2016
2015 Synthesis and Characterization of Silver Nanowire Suspensions for Printable Conductive MediaECS Journal of Solid State Science and Technology.  4:P3075-P3079. 2015
2014 Observation of a Limit Cycle in Potential Oscillations during Copper Electrodeposition in a Leveler/Accelerant SystemJournal of the Electrochemical Society.  161:D97-D101. 2014
2014 On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper ElectrodepositionJournal of the Electrochemical Society.  161:D663-D665. 2014
2011 NMR Spectral Studies of Interactions Between the Accelerants SPS and MPS and Copper ChloridesJournal of the Electrochemical Society.  158:D143-D148. 2011
2010 Pattern Formation in Anodic Aluminum Oxide Growth by Flow Instability and Dynamic RestabilizationJournal of the Electrochemical Society.  157:C388-C391. 2010
2007 Nucleation of tin and tin-silver alloy on copper and nickel in acid plating bathsJournal of the Electrochemical Society.  154:D550-D556. 2007
2005 High-aspect-ratio copper-via-filling for three-dimensional chip stacking - II. Reduced electrodeposition process timeJournal of the Electrochemical Society.  152:H173-H177. 2005
2005 Influence of additives on the growth velocity and morphology of branching copper electrodepositsJournal of the Electrochemical Society.  152:C149-C157. 2005
2005 Surface adsorption of PEG and Cl- additives for copper damascene electrodepositionElectrochemical and Solid-State Letters.  8:C6-C8. 2005
2004 Corrosion of steel reinforcement in concrete adjacent to surface repairsACI Materials Journal.  101:266-272. 2004
2003 Pattern recognition and scaling studies of copper electrodeposition on Cu(100) in the presence of additivesJournal of the Electrochemical Society.  150:C533-C537. 2003
2003 Corrosion of copper in acid-sulfate plating baths with additivesPlating and Surface Finishing.  90:40-44. 2003
2000 Faceting and roughening transitions on copper single crystals in acid sulfate plating baths with chlorideJournal of the Electrochemical Society.  147:1038-1045. 2000
1998 Kinetic selection of morphology and growth velocity in electrochemical depositionPhysical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics.  57:6955-6961. 1998
1998 A reaction-plane model for the open-circuit potential of copper in aerated copper sulfate solutionJournal of the Electrochemical Society.  145:590-595. 1998
1997 Atomic force microscopic imaging and velocity measurement of monoatomic terrace motion on the (111) Cu surface during electrodepositionJournal of the Electrochemical Society.  144:L261-L262. 1997
1996 Branched copper electrodeposition on a substratePhysica A: Statistical Mechanics and its Applications.  233:730-741. 1996
1996 Runaway growth in two-dimensional electrodepositionEurophysics Letters.  36:253-258. 1996
1995 Kinetic anisotropy and dendritic growth in electrochemical deposition.Physical Review Letters.  75:2980-2983. 1995
1994 THE ROLE OF INDUCED CONVECTION IN BRANCHED ELECTRODEPOSIT MORPHOLOGY SELECTIONJournal of the Electrochemical Society.  141:1206-1212. 1994
1992 ELECTROCHEMICALLY PREPARED POLY(3-METHYLTHIOPHENE) FILMS FOR PASSIVATION OF 430 STAINLESS-STEELJournal of the Electrochemical Society.  139:1021-1026. 1992
1992 GROWTH VELOCITY, THE LIMITING CURRENT, AND MORPHOLOGY SELECTION IN ELECTRODEPOSITION OF BRANCHED AGGREGATESJournal of the Electrochemical Society.  139:1044-1050. 1992
1991 MORPHOLOGY SELECTION AND THE CONCENTRATION BOUNDARY-LAYER IN ELECTROCHEMICAL DEPOSITIONJournal of the Electrochemical Society.  138:2912-2917. 1991
1991 Interfacial cellular mixing and a conjecture on global deposit morphology.Physical Review Letters.  66:1606-1609. 1991
1990 THE DYNAMIC DIFFUSION LAYER IN BRANCHED GROWTH OF A CONDUCTIVE-POLYMER AGGREGATE IN A 2-D ELECTROLYSIS CELLJournal of the Electrochemical Society.  137:1655-1656. 1990
1989 ROUGHNESS DEVELOPMENT IN METAL ELECTRODEPOSITION .1. EXPERIMENTAL RESULTSJournal of the Electrochemical Society.  136:2199-2207. 1989
1989 ROUGHNESS DEVELOPMENT IN METAL ELECTRODEPOSITION .2. STABILITY THEORYJournal of the Electrochemical Society.  136:2207-2214. 1989
1989 Laplace- and diffusion-field-controlled growth in electrochemical deposition.Physical Review Letters.  62:2703-2706. 1989
1988 DETERMINATION OF BREAKTHROUGH CURVES FOR SELECTIVE-MEMBRANE SORPTION PROCESSESChemical Engineering Communications.  72:213-219. 1988
1983 THE LEVEL SCHEME OF RE-183 AND SYSTEMATICS OF ODD-A RE ISOTOPES - INTERPLAY OF EPSILON-2-DEFORMATION AND EPSILON-4-DEFORMATION IN THE W-RE REGIONNuclear Physics A.  408:285-309. 1983

Chapter

Year Title
2013 Accelerant Effect 2013
2002 Structure and Pattern Formation in Electrodeposition 2002

Patents And Disclosures

Year Title
Treatment of Anodized Aluminum Components
liquid membrane coated ion exchange particles

Principal Investigator On

  • Silver Nanoparticle Synthesis for Printable Conductive Media  awarded by National Science Foundation (NSF) 2012 - 2016
  • Chemical Design and Electrochemical Process Engineering for Microfabrication  awarded by National Science Foundation (NSF) 2009 - 2012
  • Electro-Analytical Studies on Copper Electroplating Chemistries for Through-Silicon Via Filling  awarded by Rohm and Haas 2008 - 2009
  • Electro-Analytical Studies on Copper Electroplating Chemistries for Through-Silicon Via Filling  awarded by Rohm and Haas 2007 - 2009
  • NH IRC: Cubic Wafer - Electrochemical Processing for 3D Micro-Electronics Packaging  awarded by Cubic Wafer 2006 - 2007
  • NH IRC: Advanced Process Technology for Wafer-Level, Three-Dimensional Integrated-Circuit Packaging  awarded by Cubic Wafer 2005 - 2006
  • NHIRC: Heat Pipe Aging  awarded by Aavid Thermalloy 2002 - 2003
  • Microscopic Dynamics of Roughening in Copper Electroplating  awarded by National Science Foundation (NSF) 1997 - 1999
  • IRC Company Match  awarded by Conproco Corporation 1996 - 1997
  • Microscopic Dynamics of Copper Electroplating  awarded by National Science Foundation (NSF) 1995 - 1996
  • Conductive-Polymer Filaments for Sensors  awarded by National Science Foundation (NSF) 1994 - 1995
  • Interfacial Dynamics of Dendrite Electrodeposition  awarded by National Science Foundation (NSF) 1993 - 1995
  • Pattern Formation in Electro-crystalization of Metals  awarded by North Atlantic Treaty Org (NATO) 1992 - 1994
  • ELECTRODEPOSITED POLYMERIC FILMS CORROSION INHIBITION  awarded by US DOD, Army 1988 - 1993
  • Teaching Activities

  • Intro Chemical Engineering I Taught course 2018
  • Intro Chemical Engineering II Taught course 2018
  • Corrosion Taught course 2017
  • Corrosion Taught course 2017
  • Corrosion Taught course 2017
  • Corrosion Taught course 2017
  • Intro Chemical Engineering I Taught course 2017
  • Chemical Engineering Project Taught course 2017
  • Doctoral Research Taught course 2017
  • Intro Chemical Engineering II Taught course 2017
  • Intro Chemical Engineering II Taught course 2017
  • Intro Chemical Engineering II Taught course 2017
  • Advanced Fluid Mechanics Taught course 2016
  • Chemical Engineering Project Taught course 2016
  • Doctoral Research Taught course 2016
  • Intro Chemical Engineering I Taught course 2016
  • Corrosion Taught course 2016
  • Corrosion Taught course 2016
  • Doctoral Research Taught course 2016
  • Intro Chemical Engineering II Taught course 2016
  • Intro Chemical Engineering II Taught course 2016
  • Intro Chemical Engineering II Taught course 2016
  • Intro Chemical Engineering I Taught course 2015
  • Rsrch Exp/Chemical Engineering Taught course 2015
  • Doctoral Research Taught course 2015
  • Intro Chemical Engineering II Taught course 2015
  • Intro Chemical Engineering II Taught course 2015
  • Intro Chemical Engineering II Taught course 2015
  • Rsrch Exp/Chemical Engr Taught course 2015
  • Adv Rsrch Exp/Chemical Engr Taught course 2014
  • Doctoral Research Taught course 2014
  • Intro Chemical Engineering II Taught course 2014
  • Intro Chemical Engineering II Taught course 2014
  • Intro Chemical Engineering II Taught course 2014
  • Education And Training

  • B.A. Chemistry, Clark University
  • M.S. Chemical Engineering, University of Cincinnati
  • Ph.D. Chemical Engineering, University of California - Berkeley
  • Full Name

  • Dale Barkey